Surface Mount Parts
No Clean Lead Free SMT Solder Paste Screen Printing Oubel 500g RoHS Approved
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Product Details
Place of Origin: China
Brand Name: SMT VIETNAM
Model Number: SMT VIETNAM38800KF
Payment & Shipping Terms
Minimum Order Quantity: 1pcs
Price: Negotiation
Packaging Details: Box
Delivery Time: 1-7Day
Supply Ability: 1000
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Product Details
Highlight: tin lead solder paste, no clean solder paste
Paste: Solder Paste Screen Printing
Place Of Origin:: Guangdong, China (Mainland)
Alloy: 305
Microns: 25-45um
Merit: Not Contain Harmful
Product Description
no clean lead free solder paste for screen stencil printing Oubel 500g
Detailed Product Description
1. Introduction:
Our Sn96.5Ag3.0Cu0.5 SAC305 lead free silver solder paste adopts the alloy which is formed by the 96.5% tin, the 3% silver, and the 0.5% copper. This product is desirable for the reflow soldering process which has relatively high demand. Its working temperature can be divided into three types. The preheat temperature varies from 130 degrees Celsius to 170 degrees Celsius. The melting temperature is 217 degrees Celsius, and the reflow temperature ranges from 250 degrees Celsius to 240 degrees Celsius.
The Sn96.5Ag3.0Cu0.5 SAC305 lead free silver solder paste has passed the SGS test, and achieved multiple certifications, including RoHS, REACH, and some others. Our lead-free solder cream has been exported to Germany, Russia and Spain. Moreover, we are looking for agents on a global scale. Please contact us, if you show interest in our product.
2. Chemical Component Data Sheet:
| Sort | Chemical composition (wt.%) | ||||||||
| Sn | Pb | Sb | Cu | Bi | Ag | Fe | Al | Cd | |
| Sn96.5Ag3.0Cu0.5 | Bal. | < 0.10 | <0.10 | 0.5±0.1 | <0.10 | 3.0±0.05 | <0.02 | <0.002 | <0.002 |
3. Physical Properties:
| Sort | Melting Point (℃) | Spec. Gravity (g/cm3) | Tensile Strength (MPa) |
| Sn96.5-Ag3.0-Cu0.5 | 217-219 | 7.40 | 53. |
4. Our Superiority is the Professionalism of our team.
– PCB And PCB Assembly For One-stop Service with Original Components According the BOM.
IC Imported from Digikey / Farnell etc.
– Low Cost with High Quality, Commitment of Quality Assurance.
– For 10 years Experience in PCB Field. ( Our Factory owns advanced
production equipment and experienced technical personnel. )
5. Detailed specification of manufaturing capacity:
| NO | Item | Craft Capacity |
| 1 | Layer | 1-30 Layers |
| 2 | Base Material for PCB | FR4, CEM-1, TACONIC, Aluminium, High Tg Material, High Frequence ROGERS ,TEFLON, ARLON, Halogen-free Material |
| 3 | Rang of finish baords Thickness | 0.21-7.0mm |
| 4 | Max size of finish board | 900MM*900MM |
| 5 | Minimum Linewidth | 3mil (0.075mm) |
| 6 | Minimum Line space | 3mil (0.075mm) |
| 7 | Min space between pad to pad | 3mil (0.075mm) |
| 8 | Minimum hole diameter | 0.10 mm |
| 9 | Min bonding pad diameter | 10mil |
| 10 | Max proportion of drilling hole and board thickness | 1:12.5 |
| 11 | Minimum linewidth of Idents | 4mil |
| 12 | Min Height of Idents | 25mil |
| 13 | Finishing Treatment | HASL (Tin-Lead Free), ENIG(Immersion Gold), Immersion Silver , Gold Plating (Flash Gold), OSP, etc. |
| 14 | Soldermask | Green, White, Red, Yellow, Black, Blue, transparent photosensitive soldermask, Strippable soldermask. |
| 15 | Minimun thickness of soldermask | 10um |
| 16 | Color of silk-screen | White, Black, Yellow ect. |
| 17 | E-Testing | 100% E-Testing (High Voltage Testing); Flying Probe Testing |
| 18 | Other test | ImpedanceTesting,Resistance Testing, Microsection etc., |
| 19 | Date file format | GERBER FILE and DRILLING FILE, PROTEL SERIES, PADS2000 SERIES, Powerpcb SERIES, ODB++ |
| 20 | Special technological requirement | Blind & Buried Vias and High Thickness copper |
| 21 | Thickness of Copper | 0.5-14oz (18-490um) |
6. Quote Requirements for PCB and PCB Assembly project:
– Gerber File and Bom List;
– Quote Quantity;
– Advise your technical requirements for quoting reference;
– Clearly picturers of PCB or PCB Assembly Sample to us for reference;
– Test Mothod for PCB Assembly.
7. T-SOAR Factory Silhouette:
